IAENG International Conference on Electrical Engineering (ICEE'14)

  Hong Kong, 12-14 March, 2014  
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The IAENG International Conference on Electrical Engineering (ICEE'14) will take place in Hong Kong, 12-14 March, 2014.

The conference ICEE'14 is held under the International MultiConference of Engineers and Computer Scientists 2014. The IMECS 2014 is organized by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. The IMECS conferences serve as good platforms for our members and the entire engineering community to meet with each other and to exchange ideas. Our IMECS committees have been formed with over three hundred conference committees members who are mainly research center heads, faculty deans, department heads, professors, and research scientists from over 30 countries. The last IAENG conference has attracted more than eight hundred participants from over 50 countries. All submitted papers will be under peer review and accepted papers will be published in the conference proceeding (ISBN: 978-988-19252-5-1). The abstracts will be indexed and available at major academic databases. The accepted papers will also be considered for publication in the special issues of the journal Engineering Letters, in IAENG journals and in edited books.

  Calls for Manuscript Submissions  
  Important Dates:  
  Draft Manuscript Submission Deadline (extended): 8 January, 2014 new  
  Camera-Ready Papers Due & Registration Deadline (extended): 11 February, 2014  
  IMECS 2014: 12-14 March, 2014  

The topics of the ICEE'14 include, but not limited to, the following:


Biotechnology: such as EEG, ECG, and EKG, various other monitoring equipment

Electronics: such as integrated circuit, computer, electronic amplifier

Power engineering: such as electrical generators, electric power transmission

Telecommunication: such as television, radio, mobile phone, optical multiple access technologies

Control engineering: such as auto pilot, cruise control, climate control, space exploration, smart bomb

Signal processing: such as electronic filter, digital filter, video and audio codec, radar, sonar, beamforming


Special Session: Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'14)

The special session focuses on all areas of design, analysis and tools for circuits, systems and communications. DATICS general chairman is Prof. Ka Lok Man, Xi’an Jiaotong-Liverpool University (China). Prospective authors of the special session DATICS'14 are invited to submit their draft paper to be limited to a maximum length of 6 pages in full paper at https://www.easychair.org/conferences/?conf=daticsimecs2014 by 8 December 2013.
More details of DATICS'14 can be found at:






ICEE Conference Co-Chairs and Committee Members:

Maaruf Ali
Senior Lecturer in Telecommunications Engineering & Media Technology,
Department of Electronic Engineering, School of Technology, Oxford Brookes University, UK;
Vice-chair of the IEE Berkshire Specialist Branch on Electronics, Control, Computing and Communications

Aissa Boudjella
Professor, Khawarizmi International College, Abu Dhabi, United Arab Emirates

Mu-Song Chen (co-chair)
Associate Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

Yen-Wen Chen
Associate Professor, Dept. of Communication Engineering
National Central University, Taiwan

Yung-Sheng Chen
Professor, Electrical Engineering Department
Yuan Ze University, Taiwan

Shanbao Cheng
Research Scientist, Direct Drive System @ FMC Technologies, Irvine, California, USA

Jong-Sheng Cherng
Assistant Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

T.S. Chung, FIEE (co-chair)
Professor, Electrical Engineering Department
The Hong Kong Polytechnic University, Hong Kong

Hung-Yuan Chung
Professor, Department of Electrical Engineering, National Central University, Taiwan

Yi-Nung Chung (co-chair)
Associate Professor, Department of Electrical Engineering
Da-Yeh University, Taiwan

Chun-Fei Hsu
Assistant Professor of Electrical Engineering,
Department of Electrical Engineering, Tamkang University, Taiwan

Feng-Li Lian
Assistant Professor, Department of Electrical Engineering
National Taiwan University, Taiwan

Chih-Min Lin (co-chair)
Chairman and Professor
Department of Electrical Engineering
Yuan-Ze University, Taiwan

K.L. Man
Professor, Dept. of Computer Science & Software Engineering, Xi'an Jiaotong-Liverpool University, China

Tsao-Tsung Ma
Dept. of Electrical Engineering, National United University, Taiwan

A.B. Rad (co-chair)
Professor, Faculty of Engineering and Industrial Sciences
Swinburne University of Technology, Australia

Wen-Jye Shyr
Assistant Professor, Department of Industrial Education and Technology,
National Changhua University of Education, Taiwan

Huan-liang Tsai
Associate Professor, Department of Electrical Engineering, Da-Yeh University, Taiwan

Tsung-Han Tsai (co-chair)
Associate Professor, Dept. of Electrical Engineering
National Central University, Taiwan

Rong-Jong Wai
Professor, Department of Electrical Engineering,
Yuan Ze University, Taiwan

G.C. Yang
Professor, Department of Electrical Engineering
National ChungHsing University, Taiwan


Special Session DATICS Chairman and Committee Members:


  • Ka Lok Man, Xi'an Jiaotong-Liverpool University (China)
  • Nan Zhang, Xi'an Jiaotong-Liverpool University (China)

 Organising Chairs

  • Michele Mercaldi, EnvEve, Switzerland
  • Tomas Krilavičius, Baltic Institute of Advanced Technologies and Vytautas Magnus University, Lithuania
  • Chi Un Lei, University of Hong Kong


  • Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
  • Paolo Prinetto, Politecnico di Torino, Italy
  • Massimo Poncino, Politecnico di Torino, Italy
  • Alberto Macii, Politecnico di Torino, Italy
  • Joongho Choi, University of Seoul, South Korea
  • Wei Li, Fudan University, China
  • Michel Schellekens, University College Cork, Ireland
  • Emanuel Popovici, University College Cork, Ireland
  • Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
  • Umberto Rossi, STMicroelectronics, Italy
  • Franco Fummi, University of Verona, Italy
  • Graziano Pravadelli, University of Verona, Italy
  • Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
  • Vladimir PavLov, International Software and Productivity Engineering Institute, USA
  • Ajay Patel, Intelligent Support Ltd, United Kingdom
  • Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The Netherlands
  • Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
  • Monica Donno, Minteos, Italy
  • Jun-Dong Cho, Sung Kyun Kwan University, South Korea
  • AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
  • Gregory Provan, University College Cork, Ireland
  • Miroslav N. Velev, Aries Design Automation, USA
  • M. Nasir Uddin, Lakehead University, Canada
  • Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
  • Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
  • John Herbert, University College Cork, Ireland
  • Zhe-Ming Lu, Sun Yat-Sen University, China
  • Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
  • Chin-Chen Chang, Feng Chia University, Taiwan
  • Mong-Fong Horng, Shu-Te University, Taiwan
  • Liang Chen, University of Northern British Columbia, Canada
  • Chee-Peng Lim, University of Science Malaysia, Malaysia
  • Salah Merniz, Mentouri University, Constantine, Algeria
  • Oscar Valero, University of Balearic Islands, Spain
  • Yang Yi, Sun Yat-Sen University, China
  • Damien Woods, University of Seville, Spain
  • Franck Vedrine, CEA LIST, France
  • Bruno Monsuez, ENSTA, France
  • Kang Yen, Florida International University, USA
  • Takenobu Matsuura, Tokai University, Japan
  • R. Timothy Edwards, MultiGiG, Inc., USA
  • Olga Tveretina, Karlsruhe University, Germany
  • Maria Helena Fino, Universidade Nova De Lisboa, Portugal
  • Adrian Patrick ORiordan, University College Cork, Ireland
  • Grzegorz Labiak, University of Zielona Gora, Poland
  • Jian Chang, Texas Instruments, Inc, USA
  • Yeh-Ching Chung, National Tsing-Hua University, Taiwan
  • Anna Derezinska, Warsaw University of Technology, Poland
  • Kyoung-Rok Cho, Chungbuk National University, South Korea
  • Yuanyuan Zeng, Wuhan university, China
  • D.P. Vasudevan, University College Cork, Ireland
  • Arkadiusz Bukowiec, University of Zielona Gora, Poland
  • Maziar Goudarzi, Sharif University of Technology, Iran
  • Jin Song Dong, National University of Singapore, Singapore
  • Dhamin Al-Khalili, Royal Military College of Canada, Canada
  • Zainalabedin Navabi, University of Tehran, Iran
  • Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
  • Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
  • Deepak Laxmi Narasimha, University of Malaya, Malaysia
  • Danny Hughes, Katholieke Universiteit Leuven, Belgium
  • Jun Wang, Fujitsu Laboratories of America, Inc., USA
  • A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
  • N. Jaisankar, VIT University. India
  • Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
  • Steven Hollands, Synopsys, Ireland
  • Siamak Mohammadi, University of Tehran, Iran
  • Felipe Klein, State University of Campinas (UNICAMP), Brazil
  • Enggee Lim, Xi'an Jiaotong-Liverpool University, China
  • Kevin Lee, Murdoch University, Australia
  • Prabhat Mahanti, University of New Brunswick, Saint John, Canada
  • Kaiyu Wan, Xi'an Jiaotong-Liverpool University, China
  • Tammam Tillo, Xi'an Jiaotong-Liverpool University, China
  • Yanyan Wu, Xi'an Jiaotong-Liverpool University, China
  • Wen Chang Huang, Kun Shan University, Taiwan
  • Masahiro Sasaki, The University of Tokyo, Japan
  • Shishir K. Shandilya, NRI Institute of Information Science & Technology, India
  • J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
  • Wichian Sittiprapaporn, Mahasarakham University, Thailand
  • Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
  • Kevin Marquet, Verimag Laboratory, France
  • Matthieu Moy, Verimag Laboratory, France
  • Ramy Iskander, LIP6 Laboratory, France
  • Suryaprasad Jayadevappa, PES School of Engineering, India
  • Shanmugasundaram Hariharan, Pavendar Bharathidasan College of Engineering and Technology, India
  • Chung-Ho Chen, National Cheng-Kung University, Taiwan
  • Kyung Ki Kim, Daegu University, Korea
  • Shiho Kim, Chungbuk National University, Korea
  • Hi Seok Kim, Cheongju University, Korea
  • Brian Logan, University of Nottingham, UK
  • Ben Kwang-Mong Sim, University of Kent, United Kingdom
  • Asoke Nath, St. Xavier's College (Autonomous), India
  • Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
  • Shin-Ya Takahasi, Fukuoka University, Japan
  • Cheng C. Liu, University of Wisconsin at Stout, USA
  • Farhan Siddiqui, Walden University, Minneapolis, USA
  • Katsumi Wasaki, Shinshu University, Japan
  • Pankaj Gupta, Microsoft Corporation, USA
  • Taikyeong Jeong, Myongji University, South Korea
  • Masoud Daneshtalab, University of Turku, Finland
  • Amit Chaudhry, Technology Panjab University, India
  • Bharat Bhushan Agarwal, I.F.T.M., University, India
  • Abhilash Goyal, Oracle (SunMicrosystems), USA
  • Yue Yang, EJITEC, China
  • Boguslaw Cyganek, AGH University of Science and Technology, Poland
  • Yeo Kiat Seng, Nanyang Technological University, Singapore
  • Youngmin Kim, UNIST Academy-Industry Research Corporation, South Korea
  • Tom English, Xlinx, Ireland
  • Nicolas Vallee, RATP, France
  • Mou Ling Dennis Wong, Xi'an Jiatong Liverpool University, China
  • Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
  • Xuan Guan, Freescale Semiconductor, Austin, TX, USA
  • Pradip Kumar Sadhu, Indian School of Mines, India
  • Fei Qiao, Tsinghua University, China
  • Chao Lu, Purdue University, USA
  • Ding-Yuan Cheng, National Chiao Tung University, Taiwan


  • Miquel Moreto Planas, Technical University of Catalonia, Spain
  • Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
  • Luigi Giancardi, Devoteam auSystems SpA, Italy
  • Alie El-Din Mady, University College Cork, Ireland
  • Prasad D. Khandekar Vishwakarma Institute of Information Technology, Pune
  • Hari Mohan Pandey, SVKM's NMIMS University, India
  • Vishal Bharti, Dronacharya College of Engineering, Khentawas, Gurgaon, India
  • Yiwang Wang, Suzhou Vocational University, China
  • Pavan Kumar Manchikalapudi, MNNIT, India
  • Puneet Sareen, Texas Instruments, Germany
  • Ben L Zhou, Tabula, USA
  • Razan Paul, Bangladesh University of Engineering and Technology, Bangladesh
  • Farakh Javid, LIP6 Laboratory, France
  • Sushil Menon, PES School of Engineering, India
  • Khalid Latif, University of Turku, Finland
  • Masoumeh Ebrahimi, University of Turku, Finland
  • Chi-Hua Chen, National Chiao Tung University, Taiwan









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